Today GMN presents the final article in a three part blog series focused on GMN bonding capabilities. The team here is very excited about this third bonding technology, the rigid-to-rigid optically clear adhesive (OCA) bonding, which is the newest of GMN’s bonding processes.
Rigid-to-rigid vacuum OCA bonding is a cutting edge technology that allows GMN to provide thinner bond lines and as a result, thinner overall stack ups. Rigid-to-rigid OCA bonding is a process in which a vacuum chamber removes all air from the part and allows components to be applied together with optimum optical clarity and without bubbles. This OCA is a dry film pressure sensitive adhesive.
The main advantage of this bonding technology is the thinner bond line. Whereas liquid optically clear adhesive (LOCA) bonding can achieve a bond line between .015” to .030,” OCA bonding can get even smaller, to achieve a .005” to a .008” bond line. This bonding capability is well suited for thin components including cover glass, touchscreens, and frameless LCDs.
Another advantage of the rigid-to-rigid OCA bonding is that no curing is needed. Whereas the LOCA bonding requires curing liquid through a printed border, this isn’t an issue for OCA bonding because a sheet adhesive is used instead. Using a sheet adhesive also allows the OCA bonding to provide a tighter tolerance and as a result, a consistent and flat bond line.
Consequently, with the added benefits of OCA bonding, come a few challenges. One of the most impactful difficulties is that the bonded adhesive is not re-workable. Despite this difficulty, OCA bonding is highly regarded as one of the best bonding solutions available.
GMN is very excited to offer rigid-to-rigid OCA bonding, alongside our other bonding technologies, to offer a wide variety of options to meet every project need.
Read our other blogs in the bonding series: